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American Dicing - wafer dicing and sawing, die sorting, inspection and die packaging services in the USA
Description: Production facility for semiconductor and microelectronics industry. Services include wafer dicing, die sorting, die bonding and wirebonding.
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Waferdicingusa.com
Content Revalency:
Title: 53.85%
Description: 40.00%
Keywords: 33.33% | Document size: 13,125 bytes
More info:
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WAFERDICINGUSA.COM - Site Location |
Country/Flag |
United States |
City/Region/Zip Code |
Orem, UT, 84097 |
Organization |
Unified Layer |
Internet Service Provider |
Unified Layer |
WAFERDICINGUSA.COM - Domain Information |
Domain |
WAFERDICINGUSA.COM [ Traceroute RBL/DNSBL lookup ] |
Registrar |
eNom, LLC ENOM, INC. |
Whois server |
whois.verisign-grs.com |
Created |
08-Dec-2009 |
Updated |
30-Jun-2022 |
Expires |
08-Dec-2023 |
Time Left |
0 days 0 hours 0 minutes |
Status |
clientTransferProhibited https://icann.org/epp#clientTransferProhibited clientTransferProhibited https://www.icann.org/epp#clientTransferProhibited |
DNS servers |
NS1.BLUEHOST.COM 74.220.195.31 NS2.BLUEHOST.COM 69.89.16.4
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Site Response Header |
Response |
HTTP/1.1 200 OK |
Server |
Apache |
Date |
Mon, 18 Apr 2011 03:38:37 GMT |
Content-Type |
text/html |
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