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signal integrity, high speed, high speed signal integrity, TSV, TGV, through silicon via, silicon interposer, 3D silicon interposer signal interity, through glass via, micro bump, copper pillar, IR drop, substrate design, flip chip, cavity down, power integrity, CO design, reliability modeling, 3D package, 3D packaging, advanced packaging, package design, ball grid array, ball stack, BGA, chip scale, chip scale package, CSP, DDR II, die stack, die stacking, FBGA, fine pitch BGA, land grid array, MBGA, MCP, memory modules, memory stacking, multi chip, multi chip package, package design, package solutions, package stacking, packaging, RF module, semiconductor packaging, system in a package, SIP, stacked, stacking, system in package, system integration, system level integration, system miniaturization, broadpak, thermal management, thermal modeling, 3D wafer level packaging, WLP
3D packaging ball grid array, chip scale packaging, semiconductor packaging, multi-chip package, package stacking, system level integration. broadpak produces and provides a broad range of advanced packaging solutions from stacked chip solutions to wafer level packaging.
Broadpak.com ~
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Crawford: 20/20 Vision
In a State of Perfect Balance, Crawford Ohio offers excellent sites and buildings with Interstate-quality highway access, abundant skilled labor, extensive training resources, low operating costs, and a pro-business climate second to none. The county of Crawford features three cities as well as rural areas offering diverse amenities in an area rich in agricultural and manufacturing heritage.
In the middle of everywhere, Crawford Ohio is centrally located within an easy drive from the Cleveland, Columbus and Toledo metropolitan areas.
Crawford2020.com ~
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