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Teraspeed - Interconnect Engineering, Advanced Printed Circuit Design, Signal Integrity, Electromagnetic Modeling, Package Design and Characterization, Power Analysis, Professional Training
Teraspeed, teraspeed consulting group, interconnect engineering, interconnect, signal integrity, SI, Scott McMorrow, Bernard Voss, printed circuit board design, printed circuit, printed circuit baord, pcb, printed circuit layout, layout, high-speed, telecommunications, communications, networking, switch fabric, network switch fabrick, backplane, timing analysis, IC package design, IC, package design, flip-chip, flipchip, wirebond, MCM, back plane, network switch fabric, LVDS, OC-192, OC768, OC-48, XAUI, infiniband, electromagnetic characterization, electromagnetic, characterization, propagation, power planes, simulation modeling, simulation, modeling, models, SPICE, HSPICE, HSpice, IBIS Modeling, IBIS Models, IBIS Model, IBIS, modeling, models, model, crosstalk, eye pattern, eye, stackup, stackup design, pcb stackup, training, professional training, si training, signal integrity training, spice training, EMI, loss modeling, dielectric loss, loss tangent, teraspeed, OC-192, OC-768, XAUI, xaui, infiniband, hypertransport, fiber channel, 10 Gbps, 3.125 Gbps, 40 Gbps, differential, balanced signalling, tera speed, tera-speed
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