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Thick film microcircuits, Hybrid microcircuits, Hybrid Circuits, custom
hybrid, Hybrid assembly, Hybrid packaging, print fired and trimmed (PFT) substrates,
PFT, Chip scale packaging, Wire bonding, ceramic circuits, HIC, Laser Trimming,
Microcircuit assembly, Micro-circuits, Thick film, Thick film assembly, Thick
Film Circuit Assembly, thick film circuits, HIC, SMT, SMT Assembly, manufacture
in Singapore, One stop manufacturing, Hybrionic
Thick film microcircuits,Hybrid microcircuits,Microcircuits, Hybrid IC, Ceramic Screening, CSP - Chip scale packaging, Polymer printing, Wire bonding, Hybrid assembly, Hybrid packaging, ceramic circuit, ceramic circuits, HIC, hybrid, Hybrid Circuits, hybrids, Laser Trimming, Microcircuit assembly, microcircuits, Micro-circuits, multi-layer circuits, SMT, SMT Assembly, Thick film, Thick film assembly, Thick Film Circuit Assembly, thick film circuits, Thick Film HIC, Wire Bonding
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