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development and manufacturing semiconductor A2B6 & A3B5 single crystals substrates for photonic application. Development and fabrication of Instuments & devices, based on the this single crystals,development and fabrication technological process, process technique, CdZnTe,CdZnTe substrates,CdTe,CdTe substrates,CdTe for coating, CdZnTe radiation sensor,CdTe detector,x-ray imaging sensors,pixellization technique, CdZnTe strips array, CdZnTe pixels array,HgCdTe,GaAs substrates,InAs substrates, semiconductor substrates, crystals for telecommunication and acousto optic, AgGaGeSe, Cs2HgCl4, Cs2HgBr4, Tl3PbCl5, Bridgman growing technique, High Pressure Bridgman,ZnSe,ZnSe substrates,conductive ZnSe,
crystal growing furnace, semiconductor single crystal
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Home | ThinMaterials AG
Thin Materials AG has developed for the semiconductor industry a carrier technology for ultra-thin wafers. Thin Materials´ technology allows to thin down wafers to 50 µm and less while the thinned wafer on carrier can be process “normal” wafer. The “Release Layer”, one of Thin Materials ´core technologies, allows the temporary wafer bonding and de-bonding afterwards. Wafers with or without high topography can be handled.
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