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Solder Training, IPC, J STD 610, Analylitical Laboratory, Electonics, Electronics Manufacturing, Electronics Training, Electronics Manufacturing Training, Training, BGA, CSP, C-SAM, Scanning Acoutisic microscopy, non-destructive testing, NDE, destructive testing, migration, diffusion, popcorning, EOS, ESD, gold plating, fractures, voiding, glass transition temperatures, elemental analysis, microsectioning, Highly accelerated stress testing, HAST, wetting balance, IPC-TM-650, shear testing, tensile testing, process consulting, materials testing, materials analysis, materials selection, advanced package failure analysis, bridging, electromigration, electro migration, temperature/ humidity, environmental chambers, tin whiskers, lead free solders, lead free alloys, forming gas reflow, electronic materials, UV-Vis Spectroscopy, wet chemistry, lead free testing, ROSA, X-ray analysis, transmission X-ray imaging, nano-focus X-ray imaging, CTE testing, residue analysis, underfill failure, plated through hole separations, dendrite growth, moisture sensitivity, electronics packaging, interconnection, socket failure, through hole failure, salt fog, dimensioning, reliability testing, PWB qualification, Component qualification, product development, mechanical shock, passive component failure, surface oxidation, corrosion, fretting corrosion, dip & look, solder ball test, impedance tests, failure verification, test failures, testing, cleanliness testing, solderability testing, failure analysis, ion chromatography, IC testing, resistance of solvent extraction, ROSE testing, scanning electron microscopy, SEM, energy dispersive spectroscopy, EDS, component failure analysis, Fourier Transform Infrared Spectroscopy, FTIR, FTIR database, sequential electrochemical reduction analysis, SERA, wetting balance, thermal shock testing, vibration testing, environmental stress testing, surface insulation resistance, SIR testing, cross sectioning, contamination, electronic assembly, Pb Sn solder, PbSn solder joint, Pb-free solder, thermal cycling, shock testing, high-g testing, black-pad, purple plague, wire bond, J-STD, IPC, Au on Nickel, rapid response, MANTECH, Manufacturing Technology, NAVY, Navy, Office of Naval Research, EMPF, Electronics Manufacturing Productivity Facility, wave solder, reflow oven, BGA, packaging, advanced packaging
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